[CEONEWS = Reporter Lee Hyun-ah] As NVIDIA continues to cement its position as a global leader, surpassing even Apple, Microsoft, and Tesla in market valuation, its CEO Jensen Huang is steering the company through groundbreaking advancements and high-stakes partnerships. Among the latest developments is the potential adoption of Samsung Electronics' High Bandwidth Memory (HBM) in NVIDIA products, signaling a pivotal moment in the semiconductor industry.
Samsung’s HBM: A Step Closer to NVIDIA’s Arsenal
At a recent press conference in Taipei, Jensen Huang directly addressed rumors surrounding Samsung’s HBM certification tests. Confirming that Samsung’s HBM products are undergoing rigorous evaluation, Huang dismissed claims of test failures. “Samsung has not failed any certification tests, but its HBM products require further engineering work,” he stated, emphasizing patience as the testing process continues.
If the certification proceeds smoothly, Samsung could begin supplying HBM3E 12-layer stacks to NVIDIA as early as the second half of the year. This would mark a significant win for Samsung, which is pushing aggressively to lead the next-generation HBM market. The company has already made strides with the mass production of its 8-layer HBM3E and aims to produce 12-layer products soon, showcasing the industry’s largest-capacity HBM3E with 36GB using advanced TSV technology.
NVIDIA’s Accelerated Product Roadmap and Industry Impact
Huang’s decision to shorten NVIDIA’s GPU launch cycle from two years to one has intensified competition among memory suppliers SK Hynix, Samsung, and Micron. The increased demand for HBM, driven by NVIDIA’s rapid product releases, is reshaping the semiconductor landscape.
At Computex 2024 in Taipei, NVIDIA unveiled the Rubin GPU, the first to adopt 6th-generation HBM (HBM4). Scheduled for release in 2026, Rubin will feature eight HBM4 modules, with Rubin Ultra in 2027 incorporating 12 modules. Meanwhile, NVIDIA’s current GPUs, such as the Blackwell series, will integrate 8-layer and 12-layer HBM3E chips, further boosting demand.
In response, SK Hynix is preparing to mass-produce 12-layer HBM3E by Q3 and advancing its HBM4 production timeline to next year. Micron, a relative newcomer in the HBM market, is leveraging strong U.S. government backing to increase its market share, aiming to reach 30% by 2025.
NVIDIA’s Unprecedented Market Valuation
Amid the AI boom, NVIDIA has achieved a remarkable milestone, becoming the world’s third most valuable company after Microsoft and Apple. With a market capitalization exceeding $2 trillion for the first time, NVIDIA has surpassed Saudi Aramco, solidifying its dominance in the tech industry.
This surge in valuation has also elevated Jensen Huang’s personal wealth. As NVIDIA’s co-founder and CEO, Huang’s stake in the company is valued at over $69 billion. Known for his visionary leadership, Huang has positioned NVIDIA at the forefront of the AI revolution, driving both technological innovation and market confidence.
The Road Ahead
Under Huang’s leadership, NVIDIA continues to push the boundaries of innovation, from AI-focused GPUs to transformative partnerships with memory suppliers. As Samsung, SK Hynix, and Micron vie for dominance in the HBM market, NVIDIA’s rapid growth and strategic decisions will undoubtedly shape the future of the semiconductor industry.
Huang’s emphasis on patience and precision underscores a broader lesson for the tech world: true innovation requires time, collaboration, and a relentless drive for excellence. As NVIDIA accelerates toward new horizons, its journey serves as a testament to the power of visionary leadership and strategic foresight.
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